Rapier is proven_, hot air knife technology that can now be retrofitted to almost any wave-soldering machine. 

Sited just after the solder wave, the low pressure continuous jet of hot air is directed at the underside of the assembled board, close to the board and at a pre-set angle. 

The hot air jet removes excess molten solder from joints, dramatically reducing the incidence of bridging on both SMT and conventional through hole joints. Smaller, well sculpted solder filets are produced, which are easier to inspect and transmit less mechanical stress to devices under board deflection.

Although primarily designed for debridging the Rapier provides other benefits including the non-destructive stress testing of every solder joint. Poorly or marginally wetted joints are blown away while good joints are merely improved in shape. This makes subsequent identification of poorly formed joints far easier during inspection.

By using a Rapier Air Knife, drain from the underside of the assembly is not totally dependent on solder fluidity. As fluidity is largely considered to be a function of process temperature, it is possible to run machines at lower temperatures when an air Knife is fitted and in use. With the inevitable increase in melting temperatures of the new, lead free alloys, the use of Rapier Air Knife technology will go a long way to offset the increased thermal stresses to which devices and assemblies will be subjected.

	Easily retrofitted to most wave-soldering machines.
	Reduces incidences of bridging.
	Ensures accurate inspection procedures.
	Effective for  both SMT and conventional devices.