Condensation Reflow Oven

The Condenso operates by injecting a precise quantity of liquid with a known boiling point on to a hot plate inside the oven.  The liquid vapourises and creates a inert atmosphere at a temperature 5ºC above the melting point of lead free solder.  Through condensation heat is transferred uniformly to all components and pcb's inside the oven.

After soldering the vapour is removed  by negative pressure which ensures a complete and instant drying of parts.

Condenso allows for soldering and reflowing of alloys at temperatures 5 to 10ºC above their melting points. This enables lead- free alloys to be reflowed without the risk of overheating the components, whilst matching reflow cycle times of standard lead alloys.

The Condensoline is an in-line version of the Condenso allowing  greater production throughput. It is compatible with SMEMA regulations.

Advantages