The Hi Check 500 is a low cost system designed for non contact measurement of printed solder paste and glue deposit height.  This system gives consistent accurate readings (down to ±0.003mm), minimizing rework requirements and therefore improving yields.

The base system has a 9" monochrome monitor and digital read out.  It can also be connected to a SPC printer to allow the downloading of data to spreadsheets or SPC packages.

The system has various options such as colour monitor, x y, volume measurement and data transfer software to enhance its versatility.

Inspection And Measurement Tool

The Hi Check 600  is a cost engineered version of the SPIDA giving the benefits of PC control but with some of the features of the SPIDA removed.

The machine is PC based with 15" high resloution colour monitor, x 50 magnification, 45mm focal length, 30mm vertical clearance, 315mm throat, 250 x 250 locking xy stage, vertically adjustable head, integral illuminator.

Software for measuring x,y,z and volume, saving of data and pictures and SPC calculations on Z data is standard.

Typical applications: